New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization

A glass-ceramic multichip packaging technology for high-I/O-count, large-area silicon chips is discussed. The module substrate material is a new glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./ degrees C). This material possesses a low dielectric constant