Very long CMOS linear array image sensor assembled in a ceramic 554 pin grid array package

The development of a CMOS linear array image sensor assembled in a multilayer ceramic package for industrial inspection and machine vision applications with atypical dimensions is the object of this paper. The global mechanical characteristics of this sensor are not common; the photosensitive area is composed of 32640 pixels in one dimension. We studied different package's structures, which need to meet the mechanical specifications inherent of the image sensors. Flatness of the pixel area is one of the most important characteristic and considering the dimensions, keeping it as low as possible is a big challenge and has to be managed carefully.