SiC rectifier bridge and smart switch assembly for aeronautics compatible with high temperature harsh environments

This work aims to develop and compare new encapsulant materials compatible with SiC components in order to propose demonstrators compatible with high temperature (junction temperature of 300°C, ambient temperature of 200°C) and large delta T (-65°C to 250°C) environments. Several materials have been tested and characterized as raw materials and once processed to build test vehicles packages in order to validate best formulation for demonstrator manufacturing.