Ultra-thin electronic device package

We report in this article a feasibility study of ultra-thin device packages that combine thin IC chips, thin flex circuit and adhesive flip chip technology. Using this novel packaging concept, we constructed a 512 Kbyte SRAM memory module that was less than 150 micron thick. Even more profoundly, the package was flexible enough to conform to nonplanar surfaces. This unique property can lead to new applications that would not be feasible otherwise and extend the reach of electronics into brand new areas. Two of these ultra-thin modules were stacked to construct a 3D package with 1 Mbyte of memory capacity that is /spl sim/30 times thinner and 30 times lighter than a conventionally packaged device.