Simulation and analysis of the ultra-wideband RF front-end mixed signal circuits

In this paper, an ultra-wideband RF front-end mixed circuit system is simulated and analyzed. Low temperature co-fired ceramic (LTCC) multi-layer fabricated technology and multi chip module (MCM) technique are employed to integrated the digital and analog/RF circuits within the mixed signal system. In order to improve the accurate and design efficient of the system, the characteristics of the circuits, such as power integrity, signal integrity and 3-D electromagnetic properties, are simulated and analyzed. Based on the simulation results, some methods have been introduced to improve the performances of the circuits.