High reliable and mass production-able flip chip package using non conductive film resin

A novel flip chip packaging technology using nonconductive underfill resin sheet has been studied. The process is simpler than the current process using liquid underfill resin. First, an epoxy base resin underfill sheet is laminated onto a substrate including land electrode. Next, a bumped die alignment and attachment is done with proper pressure and temperature through the resin sheet layer. The bumps eventually reach to the metal land electrode of the substrate in this process. Finally, the complete metal connection between a chip and substrate is achieved. The interface resin is cured at the same time. This new process has great potential to make flip chip assembly simpler than the current flip chip process using a liquid underfill resin with dispensing process. In this paper, we studied the suitability of this new packaging process to some established flip chip bonding machines, with respect to productivity and reliability. We found that this new process worked well with all FC bonding machines, and the reliability of packages was enough to meet the market requirement, unrelated to machine capacity.