On-wafer process for mass production of hybrid integrated optical components using passive alignment on silicon motherboard

In recent years the widespread use of optoelectronic components has been restricted by their high cost. The major reasons come from the facts that the active alignment of optical fibers to laser diodes takes lengthy tact time and makes its automation for production extremely difficult, and that facilities needed to manufacture require a considerable investment with a reasonably large volume production. In this work, the wafer-scale package process for volume production of hybrid integrated optical components was represented by using the passive alignment of the precisely cleaved laser diode and semiconductor waveguide on micromachined silicon optical bench. As an alternative assembling method, we also designed the batch transporting technique with micromachined silicon guiding plate, which was used as a processing unit through the entire manufacturing procedure from die bonding to hermetic sealing. This batch packaging technique can be applied to improve the manufacturing scheme of optoelectronic device package process, and therefore take an important role in reducing the packaging cost for hybrid integration of the optoelectronic components.