Design and simulation of MEMS thermal and vibration isolator based on PDMS beam arrays

This paper proposes a MEMS thermal and vibration isolator to be integrated with micro devices. The isolator is able to generate an attenuated thermal and vibration condition via lock-shaped polydimethylsiloxane (PDMS) beam arrays due to the ultra-low thermal conductivity and Young modulus of PDMS. Thermal simulations have been carried out to indicate the efficient heat resistance of the isolator in both static and transient heat transfer processes. And harmonic response simulations have also been conducted to test the performance of vibration isolation. This approach decouples the design of harsh environment resistance from the device design, guaranteeing device performance in both thermal and vibration working conditions. It may broaden the application domains of MEMS devices, especially in military and space missions.