A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

In this paper we present a technology for the production of randomly shaped 3D electronic circuits, which is complementary to the 3D-MID technology. The technology is based on conventional printed circuit board (PCB) technology, thermoplastic polymer encapsulation and thermoforming of the flat polymer carrier with the embedded circuit. Meander shaped Cu lines between components are stretched during the thermoforming while maintaining their interconnection function. The feasibility of this process has been demonstrated by producing functional free-form LED circuits.