3D silicon multi-chip-modules

Multi-Chip-Modules offer the potentiality to increase Packaging density in future microsystems. The advantages are : higher speed, performance, density, reliability and possible lower cost. In the Microsystern approach, LETI has developed a MCM D technology ( PI/Cu) with decoupling capacitorand Flip - Chip bonding. 3D solutions have been presented recently by several teams in the world, using: Nficropackages (TSOP, LCCC), Bare chips, MCM, Silicon wafers.