Inorganic materials solution for multi-chip modules and high speed multi-layer hybrids

As a response to the ever ancreasang demands made on materials for advanced interconnection technologies, a materials system based on etched gold conductors and a new kind of thick film dielectric is being developed. The dielectric is derived from powders, produced from chemical precursors using sol-gel processing techniques, which are dispersed in a photosensitive vehicle. The material offers very low penaittivity (around 4) and, using simple photcprocessing, vias smaller than 25 microns may be resolved. This technology readily lends itself to the production of high density muiti-chip modules and advanced multi-layer Irvbrid circuits, offering both low cost and high reliability.