A single-package solution for wireless transceivers

Although a single-chip solution seems to be ultimate goal for the design of wireless transceivers, there are many reasons to believe that this approach is not feasible for high performance applications. Especially the RF front-ends of these transceivers require components that are difficult to combine into one single chip. As an alternative we propose a single-package solution that contains different components that are interconnected with a multi-chip module (MCM) interconnect technology. By implementing passive front-end components directly into this interconnect technology, instead of using external commercial components, a cost-effective realization of the front-end can be obtained with a higher performance or a lower power consumption.