Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIs

Aluminum and its alloys are the most common materials used for interconnections in LSIs. However, as the deep sub-micron regime of device dimensions is approached, several problems arise in the use of aluminum for wiring. These include high resistance and poor electro-migration reliability when the wiring is very fine. Currently, copper is expected to be used in place of aluminum to solve such problems, and many intensive studies of copper interconnections have been reported.