Typical failure mechanisms of plastic encapsulated devices' internal connection

Due to its advantages in terms of cost, size, weight, performance and availability, plastic encapsulated devices are used widely. However, the long-term reliability of plastic encapsulated devices is influenced by the internal connection failure between dies and lead frames, including first bond, second bond, bond wire and die-attach. The paper introduced five common failure mechanisms of internal connection: intermetallic compound, bonding crater, adhesive climbing, corrosion and interfacial delamination. Some failure mechanisms are caused by internal connection's defects themselves and others by plastic encapsulation defects. The failure mechanisms are illuminated by theories combining with cases.