An Arrhenius-type constitutive model to predict the deformation behavior in lead-free solders

In the paper, the compression deformation behavior in lead-free solders were conducted on a MTS-809 material tester at the temperature range of 233-398 K with the strain rate in the range of 0.001-0.1 s
^-1
and the height reduction of 60%. The results show that the stress-strain curves of lead-free solder Sn3.0Ag0.5Cu are influenced by temperature softening and strain rate hardening effects. Based on the experimental results, the incorporated influence of strain rate and temperature on the flow behavior is often described by using an Arrhenius-type constitutive equation. The hyperbolic sine equation is often used to relate the flow stress of wide variety of materials to deformation condition.