Effect of heat treatment on the adhesion characteristics of flexible copper clad laminate with ion injection

Recently, with the trend of microminiaturization of electronic products, the demand of flexible copper clad laminate (FCCL) is increasing every year. However, there was a significant issue that the adhesion strength between the metal and polymer was inherently weak. In this paper, the effect of the adhesion strength and surface morphology on flexible copper clad laminate (FCCL) made by ion injection technique was evaluated. The changes in the morphology were studied by scanning electron microscopy (SEM). Additionally, the chemical bonding and adhesion properties were respectively characterized by X-ray photoelectron spectroscopy (XPS) and 180° peel test. The results showed that the adhesion strength of FCCL and the roughness of polyimide surface decreased as the heat treatment temperature and treating time increased. On the other hand, XPS results showed that the proportion of C-H bond increased while the proportion of the C-O and C-C bonds decreased in the polyimide surface after heat treatment.