Research on the risk identification of mechanical stress damage during electronic assembly process

In order to reduce the mechanical stress damage caused by the electronic assembly processing, it is necessary to recognize stress risk and formulate effective technique to manage it. By using resistor straining testing technique, the distribution map of strain of PCB were obtained during the typical electronic assembly processes including depanelling and fastening screws, which clearly demonstrate the relative stress risk level. In addition, the solution was put forward from the aspects of process parameter control to the component layout and so on.