Near neighbor sort yield and wafer sort yield impact on product burn-in and a time dependent reliability study

A relationship between yield and reliability based on sort local yield or sort near neighbor statistics and wafer sort yield is examined using a production dataset of an AMD CPU product. A comparison is made between the effectiveness between near neighbor statistics and wafer sort yield for predicting downstream fails. Failure-in-time data is also collected during production burn-in to then model the time-dependent impact of near neighbor sort yield. An approach is developed to use this data to predict optimal burn-in durations of different categories of die while maintaining the same outgoing quality or FIT rate.