Time-ordered events CPU reliability assessment

IC product use conditions (UCs) are needed to enable accurate reliability modeling in the context of knowledge-based qualification. We describe a method of use condition development which is based on the sequence of user foreground events from field surveys. Events are converted to temperature and voltage use condition traces accounting for lab data on representative workloads and thermal modeling. The temperature and voltage data are paired for client CPU UC data and used to estimate the reliability risks for both silicon and thermo-mechanical failure mechanisms. The new approach are validated using field consumer data. We also describe the future work needed on how to account for concurrent events and the implications on TOE methodology.