Improve electrical performance of interconnects using inkjet printing

In this paper, a technique is proposed to improve the electrical performance of high speed signaling through direct printing additional dielectric or other types of materials onto the PCB interconnect using inkjet printing. Inkjet printing is used to coat thin film or other structures onto the microstrip, via pad, pin field, or other structures on PCB. The electrical performance of interconnects can be adjusted and improved through such process. As an example, Inkjet printing can be used to increase the dielectric thickness of microstrip cover layer (soldermask), and thus to suppress the far end crosstalk and improve the insertion loss. This potentially is better than conventional PCB manufacturing techniques such as photo-lithography, which requires many process steps, which lead to higher cost and longer development time.