Thermosyphon-cooled bellow liquid heat sink

A self contained thermosyphon-cooled flexible bellow liquid heat sink was developed for cooling electronic circuit boards. The prototype system combines the benefits of both flexible bellows and thermosyphon technology. A finned flat-plate thermosyphon was designed and tested for natural convection application under various heat source temperatures. Extensive measurements were made on the combined heat sink system comprising the flat-plate thermosyphon and the flexible bellows. Experimental results showed that the dissipation capacity of the prototype liquid heat sink is about 0.006 W/cm/sup 2/K, which is about six times larger than that using normal convection cooling by the ambient surrounding. The system can maintain the temperature of the heat sources at about 20 K lower that without the application of such a system.