A Novel Package Feasibility Study Tool for Power Delivery Network Design and Optimization

The paper presents a novel package feasibility study tool for package Power Delivery Network (PDN) design and optimization. To capture the loop inductance of various package PDNs, closed-form expressions have been developed for patterned via inductance and plane inductance including regular and irregular plane shapes, which are efficient yet accurate. The closed-form inductance formulas are based on partial self and mutual inductance. The partial inductance matrices are computed according to the via and plane structure dimensions. Then loop inductance can be derived from the order reduction of partial inductance matrices once the current loops are defined. Our tool has been validated through the commercial 3D EM simulator for the typical PDN structures. We also apply our techniques to extract PDNs inductance for a high speed serial link IC package. The time is greatly reduced from hours/days to several minutes while achieving the same order of accuracy as a 3D EM tool.