Forward Tactile Sensing Device Development and Biopackaging for Endovasular Guidewire Intervention Application

Revascularization procedure for peripheral arterydisease is dependent on surgeon's skill and experience for asuccessful procedure. An integrated sensor on guidewire isproposed to reduce such dependency during the procedure. The development and packaging of the sensor with a hybridsilicone-polymer substrate (HSPS) and a silicon stopper arepresented in this paper. A compact HSPS (0.4mm x 10mm x0.31mm) with trace width/spacing of 20µm/20µm for fiveoutput signals and Si stopper with safety displacement featureto prevent force overloading are fabricated. It is able toenhanced current sensor integrated guidewire by improvingthe robustness and provides a forward sensing mechanism(orthogonal assembly). The assembled device is able tomeasure up till 42mN force with a resolution of 0.2mN. Detailof characterization testing and result will be presented in the paper.