Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications

This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance of the present integration. The weakest link is always the BEoL level. There is no hybrid bonding-related failure.