A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last

This paper compares the attributes of the embedded wafer level BGA (eWLB) and a flip chip package structure, called Fan-Out Chip Last Package (FOCLP). The comparison involves a study in finite element modeling, advanced warpage metrology, reliability testing and physical structure comparisons. The purpose of this study is to understand the similarities and differences between these two package structures. It is clear from these studies that these two packages are very similar in form, format and function. In other words, the FOCLP package may be a practical replacement of the eWLB package. An additional advantage of the FOCLP package is that it can be manufactured in high volume using existing flip chip infrastructure while the eWLB requires costly investment in wafer level equipment.