Improved Package Modeling and Correlation Methodology for High Speed IO Design

Predicting and optimizing the package electrical performance for high speed input/output (IO) design requires an accurate and robust modeling methodology. Such a methodology requires high fidelity representation of physical structures and accurate characterization of broadband frequency dependent material properties. In addition, a modeling to measurement correlation flow that can very accurately de-embed the parasitics of probe pads and transitions from measured data is also required to validate both the modeling methodology itself and the modeling input parameters. In this paper, a comprehensive flow for an improved package modeling and a correlation methodology for high speed IO design is presented that is verified with measured and modeled results for both single-ended and differential package transmission lines.