An electromagnetic micro-undulator

Microfabrication technology using the LIGA (a German acronym for Lithography, Electroforming, and Molding) process offers an attractive alternative for fabricating precision devices with micron-sized features. One such device is a mm-sized micro-undulator with potential applications in a table-top synchrotron light source for medical and other industrial uses. The undulator consists of a silver conductor embedded in poles and substrate of nickel-iron. Electromagnetic modeling of the undulator is done using the eddy-current computer code ELEKTRA. Computations predict a field pattern of appropriate strength and quality if the current can be prevented from being shunted from silver by the nickel-iron poles either through insulation or through slotted poles. The design of the undulator along with the computational results are discussed.