Development of heat sink integrated transfer molded power modules with Thermal Conductive Insulating Sheet

The heat sink integrated transfer molded power module has been developed in order to improve power density for the industrial inverter power module. In the conventional case type structure, heat from semiconductor chips has dissipated to the heat sink through the grease. However, with the introduction of Thermal Conductive Insulating Sheet (TCIS) and the caulking fin base/plate fins it is possible to fabricate a grease-free structure with the new structure. Compared with the conventional structure, thermal resistance of the developed new module can be reduced 60% by utilizing the latest 12 W/(m · K) TCIS. Furthermore, power density (output power [W]/ volume [mm3]) was increased about 1.6 times due to the improvement of heat dissipation performance.