A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies

We present a new concept of a high-current SiC power module with the fast switching capability based on a stacked-ceramic-substrate structure. This approach enables to parallel many small area SiC devices in a housing of a Si half-bridge module. The internal design of the module - concept demonstrator was optimized using electromagnetic simulations in order to minimize stray inductance and balanced current sharing. The prototype was assembled exploiting conventional packaging technologies. Performance of the assembled module was tested by a double-pulse measurement test in order to determine switching losses and verify simulated stray inductance.