Towards vertical power device 3D packaging on 8-inch wafer

This paper presents a wafer-level fabrication process of 3D power module based on 8-inch wafer devices and 8-inch metallic bulk leadframe. This approach relies on the intermixing of the packaging process with the front-end fabrication of the power devices. The specific processes to obtain functional power devices and the metallic bulk leadframe manufacturing are described in the paper as essential key enablers of this packaging approach.