Intelligent measuring system for testing and failure analysis of electronic devices

The article deals with the organization of tests for electronic devices, designed to work in difficult operating conditions, such as conditions on the board of a spacecraft. The intelligent measurement system for monitoring the technical state condition of chips through measurement of surface temperature field is presented. A method for decision making based on comparative analysis of measured thermograms and thermal images obtained on computational models for various chip failures is considered. An application of an integrated Raman-infrared thermography to measure the internal chip temperature areas is proposed.