Two phase closed loop cooling system with a pump

Recently, water cooling has become one of the major cooling solutions for electronic devices operating in high heat-flux applications. In the near future, it is expected that much lower thermal resistances at smaller flow rates than current water cooling solutions will be required. This paper discusses the operational criteria and thermal performance of a pump-driven two-phase cooling system that we have developed to meet future thermal expectations. The thermal performance of this cooling system was tested with Fluorinert as the working fluid. It was found that the pumping power of this two-phase cooling system was at least 10 times lower than that of a water cooling system at the same thermal performance level. It was also revealed that a layer of micro-powder sintered onto the surfaces of the evaporator plate fins enhanced the mean heat transfer coefficient around 1.4 times higher than that of non-sintered surface at a flow rate lower than 0.4 L/min.