Topology optimization for efficient heat removal in 3D packages

In this study, we describe a strategy and code for optimal thermal design of multi-layer electronic structures and assemblies. A steady state heat conduction finite element analysis code is coupled with a sequential quadratic programming (SQP) algorithm to determine the optimal thermal design of thermal interface material (TIM), heat spreader and thermal through silicon vias (TSVs) under specified metallization percentage constraints. The optimization is carried out using the solid isotropic material with penalization (SIMP) method to iteratively update the (finite) element material density until the optimal material density distribution of designated regions is achieved. Furthermore, the sensitivity analysis was implemented to enable efficient optimization. The results demonstrate an easy to use, efficient and automated, thermal design tool for 3D packages that could provide early stage thermal design evaluation and optimization.