A high performance Multi Component Carrier with Chip Scale Package

In this paper, we discuss the design of a four (4) chip Multi Component Carrier (MCC) package and feasibility for use in high-end server/mainframe applications. A new class of organic, Chip Scale Package (CSP) and associated design ground rules were created based on a low, coefficient of thermal expansion (CTE) organic material, in addition to the CSP form factor. Micro Ball Grid Array (BGA) is used to connect the CSP to a daughter card assembly to form the MCC package structure. The low CTE organic substrate significantly reduces the internal stress that arises from the chip to substrate bond and assembly process, which enhances the yield and reliability of the CSP and the entire MCC structure. Numerical simulation using the finite element method (FEM) has been conducted to evaluate and optimize the lid design of the MCC package in order to ensure reliable lid to package operation during assembly and field thermal excursions. Thermal and mechanical solutions with various combinations of geometric design are discussed.