Thermal modelling of integrated microscale heatsink structures

In this article a new methodology is introduced to create a ladder-type analytical thermal model of different microscale channel structures. The presented model is applicable to determine the local heat transfer(s) and the temperature distribution along the channel depending on the channel geometries, the thermal properties of the fluid and the wall temperature(s). The channel is cut down into several segments and for each segment a T-equivalent circuit is created. The ladder-type thermal model obtained by applying the T-equivalent subcircuit as a building block can be used as a compact model of microscale channel structures in thermal and electro/logi-thermal simulation environments.