First integration of Ni0.9Co0.1 on pMOS transistors

In 3D sequential integration, the top transistor thermal budget must be reduced to preserve bottom MOSFET performance. In order to relax this thermal budget limitation, the thermal stability of the bottom level must be increased, especially for the silicide. In that purpose, Ni
_0.9
Co
_0.1
alloy is proposed to replace the current Ni
_0.85
Pt
_0.15
silicide. For the first time, this Ni
_0.9
Co
_0.1
salicide has been integrated on pMOS FDSOI transistors with state of the art process leading to performance improvements compared to the standard Ni
_0.85
Pt
_0.15
salicide. In this study, the cobalt incorporation into the salicide has been investigated to enhance its thermal stability.