Resin Encapsulation Combined with Insulated Metal Baseplate for Improving Power Module Reliability

A newly developed packaging technology in combination with direct potting (DP) resin and Insulated Metal Baseplate (IMB) is presented. DP resin is liquid epoxy resin so that epoxy resin encapsulation can be applied to power module with conventional case-type package. By combining with IMB, that is eliminating the solder layer between insulator and copper baseplate, DP resin encapsulation contributes to prevent the degradation of solder layer under the chips. As consequence, the new package is improving the capabilities of heat cycling and thermal cycling.