TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling

This paper demonstrates the integration of microfluidic cooling for thermally limited 3-D microsystem applications. Thermal modeling of logic and memory dice on a silicon interposer is presented under air and microfluidic cooling conditions. Moreover, the electrical characteristics of micropin-fin-embedded through silicon vias (TSVs) immersed in deionized (DI) water are investigated through high-frequency measurements. The TSV capacitance and conductance are extracted from the measurements. The measurement results show that the capacitance and conductance of the TSVs increase as the micropin-fin diameter decreases at a fixed TSV pitch at high frequencies.