Form factor and cost driven advanced package substrates for mobile and IoT applications

Mobile and IoT(Internet of Things) applications require semiconductor packages with increasingly smaller form factor and higher performance, but still at low cost. This paper introduces various laminate based package substrates developed to serve these applications: ETS(Embedded Trace Substrate); ETPS(Embedded Trace and Passive Substrate); cavity substrate; high stiffness, low warpage thin substrate(80μm); and ultra thin substrate(45μm).