Thermal specifications for pluggable optics modules

Thermal aspects of pluggable optics modules operation are currently covered by manufacturer MSA agreements and by an OIF implementation agreement. This paper discusses the background that led to the creation of the OIF agreement and examines parameters as defined therein. These parameters include surface finish, flatness, case conductivity, and relative location of heat source and riding heatsink thermal interface that affect temperature losses across the interface between the module and the heatsink. A limited examination of the effects of host PCB heat loads on module temperatures and the implications for calibration of internal sensors is included.