3D-printing and electronic packaging

Achieving required performance, quality and reliability are key factors for the success and adoption of 3D printing technology in electronics manufacturing applications. This paper details the current status of 3D-Printing with regards different processes and technologies and their potential use for electronics manufacturing and packaging. The paper also presents design and modelling methodologies and toolsets and details how these can be used to understand material behavior during a 3D-printing process so that residual stress magnitudes can be minimized. The paper then provides a summary of the key challenges that need to be overcome before 3D-printing can become mainstream in the electronics industry.