Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools—Part 2

The articles in this special section focuses on the advancements in 3-D integrated circuits, systems, and CAD Tools. The papers present four more papers that highlight recent advances in test methodologies for 3-D interconnects, modeling of TSVs and TSV channels, memory architecture optimization for 3-D stacked DRAM, and codesign of 3-D CPUs and microfluidic pin-fin cooling structures.