Advanced Cu barrier CMP slurries: ACuPLANE™ 7000 platform

As the dimensions of microelectronic devices continue to shrink, the reduction of defectivity and increase in product yield across the wafer continue to be important factors when designing slurry consumables for chemical mechanical planarization (CMP). In addition, the ability to tune slurry formulations to match the increasingly diverse integration structures and required layer selectivities leads to an added level of complexity in maintaining the desired throughput and defect levels needed at the more advanced nodes.