Fabrication of 63Ni layer for betavoltaic battery

In this study, nickel electroplating on Cu and Ni plate was demonstrated in plating solution dissolved metallic nickel. Cu and Ni plate were coated with Ni at current density of 10 to 25 mA/cm2. The surface morphology of Ni deposits was investigated by SEM. Compared with Ni deposits on Cu plate, it seems that the surface was more uniformly and continuously covered on Ni plate. The Ni deposits on Cu plate were formed as noodle-like shape, and Ni plate were formed as spherical shape. It means that the substrate of Ni electroplating affect to formation of the shape of particles. In order to confirm the presence of Ni components, XRD studies were carried out. XRD patterns were observed that the crystal structure of the deposits is pure fcc Ni and no characteristic peaks of other phases were observed. The residual stresses were measured by deposit stress analyzer during Ni electroplating at the current density of 10 to 25 mA/cm2. The experimental results showed that the increase in the current density had a considerable effect on the large residual stress of the Ni deposits.