Modal analysis of a metallic via hole by the WCIP

This paper presents a new electromagnetic modeling of a via-hole using a Wave Concept Iterative Procedure. There are specific TM modes associated with the insertion of the via-hole influencing the incident and reflected waves, called the “via's modes”. The formulation and results are presented considering the influence of one and two via's mode. The advantage of the model presented is the possibility to simulate planar circuits with a layer and a via-hole considering the effects of the field that propagates around the via.