A high-density 300-Gbit/s parallel optical interconnect module with efficient thermal dissipation characteristics

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical interconnect module (OIM) with a high efficiency heat radiation structure was fabricated using a thermal via structure. The prototype OIM successfully demonstrated 25-Gbit/s error-free multimode transmissions, and the optical device temperature was less than 80°C.