New epoxy molding compounds for SMT with pre-plated lead-frame system

In recent years, the surface mounting process has become widespread in the semiconductor industry. Correspondingly, the epoxy molding compounds used for chip encapsulation have needed good reflow crack resistance in order to survive the high heat stresses of SMT. Material development engineers have continually searched for molding compound resin types that will give them optimum reliability and moldability, but at an affordable price. Biphenyl resins notably exhibit resistance to reflow cracking, but they have performance problems in terms of moldability and cost. Several variations of the conventional resin system molding compounds have been developed, but they have yet to meet the reflow crack resistance of compounds made with biphenyl resins. In light of this, we have developed new epoxy molding compounds, the KE-1800Y series, which uses the dicyclopentadien (DCPD) epoxy resin system. KE-1800Y series offers good moldability, excellent reliability and lower cost for hard to mold, thin IC packages, such as TSOPs and TQFPs. For package assemblers using the pre-plated lead-frame (PPF) assembly system, the KE-1800Y series has the option to add a proprietary class of our adhesion promoters. These additives offer high strength adhesion between the molding compound and Pd/Au or Pd pre-plated lead-frames (PPF).