Fabrication Of Silicon Micro-Probe For Vertical Probe Card Application

The bulk of the world's wafer production is still being probed with a traditional wire/needle probe card arrangement. However, the probe card with wire/needle has the limits in test frequency, cost and pin count [l]. Recently membrane probe card [2], as other type of probe card, have developed, it was also difficult to contact pads uniformly, because of difficulty in controlling constantly the tension of the membrane . As levels of integration and operating speed become higher in VLSI technology, we need more reliable probe card [3,4]. In this research, we present a new type of vertical silicon probe which is applicable for the probe card system using porous silicon micromachining [5].