Factors that influence delamination at the bottom of open TSVs

We have analyzed how the mechanical and geometrical parameters of the Open Through Silicon Vias influence failures induced by delamination of the interfaces. Through Silicon Vias are the units of the interconnection structure that establish the connection through the silicon die. We show that there are different factors that influence the failure of the device by analyzing the effect of external forces and different thicknesses of the layers on delamination. From our simulations we found how the mechanical and geometrical parameters influence the Energy Release Rate and therefore the probability of delamination.