Detection of defects on BGA solder balls using 2D and 3D methods

The paper is focused on non-destructive X-Ray method used for detection of defects. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used on daily basis. 3D method is less common and it is used for unique defects for further examination. The main contribution of this work is to allow more detailed investigation of the defects structure than before. It also describes individual defect using the 3D model. This paper deals with using these methods.